JPS62125619U - - Google Patents
Info
- Publication number
- JPS62125619U JPS62125619U JP1986013326U JP1332686U JPS62125619U JP S62125619 U JPS62125619 U JP S62125619U JP 1986013326 U JP1986013326 U JP 1986013326U JP 1332686 U JP1332686 U JP 1332686U JP S62125619 U JPS62125619 U JP S62125619U
- Authority
- JP
- Japan
- Prior art keywords
- display
- substrate
- light
- display board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Instrument Panels (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013326U JPS62125619U (en]) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013326U JPS62125619U (en]) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62125619U true JPS62125619U (en]) | 1987-08-10 |
Family
ID=30802281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986013326U Pending JPS62125619U (en]) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62125619U (en]) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6871656B2 (en) | 1997-05-27 | 2005-03-29 | Tokyo Electron Limited | Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process |
| US6890853B2 (en) | 2000-04-25 | 2005-05-10 | Tokyo Electron Limited | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
| US6921456B2 (en) | 2000-07-26 | 2005-07-26 | Tokyo Electron Limited | High pressure processing chamber for semiconductor substrate |
| US6926012B2 (en) | 1999-11-02 | 2005-08-09 | Tokyo Electron Limited | Method for supercritical processing of multiple workpieces |
| US7001468B1 (en) | 2002-02-15 | 2006-02-21 | Tokyo Electron Limited | Pressure energized pressure vessel opening and closing device and method of providing therefor |
| US7021635B2 (en) | 2003-02-06 | 2006-04-04 | Tokyo Electron Limited | Vacuum chuck utilizing sintered material and method of providing thereof |
| US7077917B2 (en) | 2003-02-10 | 2006-07-18 | Tokyo Electric Limited | High-pressure processing chamber for a semiconductor wafer |
| US7140393B2 (en) | 2004-12-22 | 2006-11-28 | Tokyo Electron Limited | Non-contact shuttle valve for flow diversion in high pressure systems |
| US7163380B2 (en) | 2003-07-29 | 2007-01-16 | Tokyo Electron Limited | Control of fluid flow in the processing of an object with a fluid |
| US7186093B2 (en) | 2004-10-05 | 2007-03-06 | Tokyo Electron Limited | Method and apparatus for cooling motor bearings of a high pressure pump |
| US7225820B2 (en) | 2003-02-10 | 2007-06-05 | Tokyo Electron Limited | High-pressure processing chamber for a semiconductor wafer |
| US7250374B2 (en) | 2004-06-30 | 2007-07-31 | Tokyo Electron Limited | System and method for processing a substrate using supercritical carbon dioxide processing |
| US7270137B2 (en) | 2003-04-28 | 2007-09-18 | Tokyo Electron Limited | Apparatus and method of securing a workpiece during high-pressure processing |
| US7307019B2 (en) | 2004-09-29 | 2007-12-11 | Tokyo Electron Limited | Method for supercritical carbon dioxide processing of fluoro-carbon films |
| US7434590B2 (en) | 2004-12-22 | 2008-10-14 | Tokyo Electron Limited | Method and apparatus for clamping a substrate in a high pressure processing system |
| US7435447B2 (en) | 2005-02-15 | 2008-10-14 | Tokyo Electron Limited | Method and system for determining flow conditions in a high pressure processing system |
| US7491036B2 (en) | 2004-11-12 | 2009-02-17 | Tokyo Electron Limited | Method and system for cooling a pump |
| JP2013242487A (ja) * | 2012-05-22 | 2013-12-05 | Dainippon Printing Co Ltd | カバー部材およびカバー部材を備えた照明装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60252324A (ja) * | 1984-05-28 | 1985-12-13 | Nippon Denso Co Ltd | 車両用液晶表示装置 |
-
1986
- 1986-01-31 JP JP1986013326U patent/JPS62125619U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60252324A (ja) * | 1984-05-28 | 1985-12-13 | Nippon Denso Co Ltd | 車両用液晶表示装置 |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6871656B2 (en) | 1997-05-27 | 2005-03-29 | Tokyo Electron Limited | Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process |
| US6926012B2 (en) | 1999-11-02 | 2005-08-09 | Tokyo Electron Limited | Method for supercritical processing of multiple workpieces |
| US7208411B2 (en) | 2000-04-25 | 2007-04-24 | Tokyo Electron Limited | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
| US6890853B2 (en) | 2000-04-25 | 2005-05-10 | Tokyo Electron Limited | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
| US6921456B2 (en) | 2000-07-26 | 2005-07-26 | Tokyo Electron Limited | High pressure processing chamber for semiconductor substrate |
| US7255772B2 (en) | 2000-07-26 | 2007-08-14 | Tokyo Electron Limited | High pressure processing chamber for semiconductor substrate |
| US7001468B1 (en) | 2002-02-15 | 2006-02-21 | Tokyo Electron Limited | Pressure energized pressure vessel opening and closing device and method of providing therefor |
| US7021635B2 (en) | 2003-02-06 | 2006-04-04 | Tokyo Electron Limited | Vacuum chuck utilizing sintered material and method of providing thereof |
| US7225820B2 (en) | 2003-02-10 | 2007-06-05 | Tokyo Electron Limited | High-pressure processing chamber for a semiconductor wafer |
| US7077917B2 (en) | 2003-02-10 | 2006-07-18 | Tokyo Electric Limited | High-pressure processing chamber for a semiconductor wafer |
| US7270137B2 (en) | 2003-04-28 | 2007-09-18 | Tokyo Electron Limited | Apparatus and method of securing a workpiece during high-pressure processing |
| US7163380B2 (en) | 2003-07-29 | 2007-01-16 | Tokyo Electron Limited | Control of fluid flow in the processing of an object with a fluid |
| US7250374B2 (en) | 2004-06-30 | 2007-07-31 | Tokyo Electron Limited | System and method for processing a substrate using supercritical carbon dioxide processing |
| US7307019B2 (en) | 2004-09-29 | 2007-12-11 | Tokyo Electron Limited | Method for supercritical carbon dioxide processing of fluoro-carbon films |
| US7186093B2 (en) | 2004-10-05 | 2007-03-06 | Tokyo Electron Limited | Method and apparatus for cooling motor bearings of a high pressure pump |
| US7491036B2 (en) | 2004-11-12 | 2009-02-17 | Tokyo Electron Limited | Method and system for cooling a pump |
| US7140393B2 (en) | 2004-12-22 | 2006-11-28 | Tokyo Electron Limited | Non-contact shuttle valve for flow diversion in high pressure systems |
| US7434590B2 (en) | 2004-12-22 | 2008-10-14 | Tokyo Electron Limited | Method and apparatus for clamping a substrate in a high pressure processing system |
| US7435447B2 (en) | 2005-02-15 | 2008-10-14 | Tokyo Electron Limited | Method and system for determining flow conditions in a high pressure processing system |
| JP2013242487A (ja) * | 2012-05-22 | 2013-12-05 | Dainippon Printing Co Ltd | カバー部材およびカバー部材を備えた照明装置 |